Products / Polishing Pads / Urethane / Dow® IC1000™ Polishing Pads
Dow® IC1000™ Polishing Pads
The Industry Standard for Chemical Mechanical Planarization
IC1000™ pad is the industry-standard polishing pad for chemical mechanical planarization (CMP). The IC1000 pad is made of a rigid, micro-porous polyurethane material. These properties enable the IC1000 pad to deliver localized planarization, excellent removal rates, low global non-uniformity and low defectivity. The IC1000 pad works effectively with slurries and conditioners to optimize CMP performance in Tungsten, Copper, ILD, STI, and polysilicon processes.
The standard thickness for an IC1000 pad is 50 mils, but it is also offered in a thickness of 80 mils if a stiffer pad is required.
Optical Endpoint Window
IC1000 pads are offered with a transparent urethane window to enable the optical endpoint technology in leading edge CMP tools. Advanced optical endpoint pads feature a window that is bonded to the IC1000 pad to prevent slurry leakage and window delamination in all CMP processes.
IC1000 pad is offered in a wide variety of grooving patterns across the surface of the pad. Please consult your local representative for the pattern that will meet the needs of your CMP applications.
A compressible subpad improves the global non-uniformity performance of IC1000 pad. These pads are offered with a variety of subpads depending on the performance needs of the process.
Suba™ IV subpad is the industry standard subpad.
SP2000 subpads are the next generation of subpads, which offer improvements in reliability and performance.
Dow® IC1000™ Polishing Pads Details
Pads are packaged face-to-face (polish side to polish side) and sealed inside a plastic bag to ensure cleanliness during transportation. The bags are taped to the side of the box to prevent the bag from slipping and damaging the pads. Pads should always remain flat. Bending pads during handling can cause wrinkles in the PSA and premature delamination of the release liner.
Berylium, Germanium, Indium Phosphide, Nickel, Polysilicon, Sapphire, Silicon Carbide, Tungsten, Zinc Selenide
|Dow® IC1000™ Polishing Pads||Dow® IC1010™ Chemical Mechanical Polishing Pads||Dow® IC1010™ Chemical Mechanical Polishing Pads with Window|
|Compressibility||2.25 %||2.25 %||2.25 %|
|Hardness - Test||Shore D||Shore D||Shore D|
Apply only to a clean, dry surface at room temperature. If an appropriate solvent, such as isopropyl alcohol, is used to clean the platen after a pad removal, allow the platen to dry completely and return to room temperature before applying a new pad. Solvents remaining on the platen or an unusually cold platen will lower PSA adhesion.
When applying the pad to the platen, peel the release liner from one edge of the pad. Fold liner back approximately 2 inches. Align the pad with the edge of the platen and adhere. In one continuous movement, slowly peel the remaining release liner off the pad while pressing the pad down on the platen. The application should be smooth and uniform with even pressure from the pad mounting tool (such as a flat disk or hand roller).
Do not try to reposition pads with PSA adhesive
Product should be stored and transported in the original packaging. The product should be stored in temperatures between 10°C to 24°C (50°F to 75°F) and <50% humidity. Exposure for six (6) months or less to conditions between -17°C to 48°C (0°F and 120°F) and/or at relative humidity of up to 100% will not impact the product performance as long as the release liner remains intact and attached to the PSA. If the product is exposed to temperatures and humidity outside the recommended conditions, it may still be acceptable for use. In all cases, the product should be allowed to return to normal room temperatures prior to use.
Dispose of in accordance with all applicable local regulations.