Category - Wafering Adhesives

Valtron® AD1210-A / AD1769-B

Slow Curing Ingot Mounting Epoxy System

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing...

Base MaterialBond Strength 8 hrs (psi)ColorCure Time (hrs)Density (g/cc)Hardness (Shore "D")Mixing Ratio (by volume)Viscosity (cps)
Epoxy1,700Gray/Red61.217710065000
Category - Wafering Adhesives

Valtron® AD1230-A / AD1210-B

Water Resistant Ingot Mounting Epoxy System

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing...

Base MaterialBond Strength 4 hrs (psi)Bond Strength 8 hrs (psi)ColorCure Time (hrs)Density (g/cc)Gel Time (min)Glass Transition Temp (.C)Hardness (Shore "D")Mixing Ratio (by volume)Moveable Time (min)Viscosity (cps)
Epoxy5001,700Gray/Green51.215040821024035000
Category - Wafering Adhesives

Valtron® AD1238-A / AD3848-BR

Fast Curing Ingot Mounting Epoxy System

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing...

Base MaterialBond Strength 4 hrs (psi)Bond Strength 8 hrs (psi)ColorCure Time (hrs)Density (g/cc)Gel Time (min)Glass Transition Temp (.C)Hardness (Shore "D")Mixing Ratio (by volume)Moveable Time (min)Viscosity (cps)
Epoxy2,2002,700Gray/Red21.215358413070000
Category - Wafering Adhesives

Valtron® AD1339-A / AD3905-B

Increased Hardness and Gel Time Ingot Mounting Epoxy System

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing...

Base MaterialBond Strength 4 hrs (psi)Bond Strength 8 hrs (psi)ColorCure Time (hrs)Density (g/cc)Gel Time (min)Glass Transition Temp (.C)Hardness (Shore "D")Mixing Ratio (by volume)Moveable Time (min)Viscosity (cps)
Epoxy1,8002,000White/Purple41.4730408516043000
Category - Wafering Adhesives

Valtron® AD1339-A / AD3939-B

Increased Hardness Ingot Mounting Epoxy System

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing...

Base MaterialBond Strength 4 hrs (psi)Bond Strength 8 hrs (psi)ColorCure Time (hrs)Density (g/cc)Gel Time (min)Glass Transition Temp (.C)Hardness (Shore "D")Mixing Ratio (by volume)Moveable Time (min)Viscosity (cps)
Epoxy1,8001,800White/Blue21.65154085160115000
Category - Wafering Adhesives

Valtron® AD4010-A / AD4015-B

Heat Release Epoxy System for monocrystalline ingot fixturing.

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing...

Base MaterialBond Strength 24 hrs (psi)Bond Strength 4 hrs (psi)Bond Strength 8 hrs (psi)ColorCure Time (hrs)Density (g/cc)Gel Time (min)Hardness (Shore "D")Mixing Ratio (by volume)Viscosity (cps)
Epoxy2,1001,1001,600White/Yellow21.14474111500
Category - Wafering Adhesives

Valtron® AD4010-A / AD4017-B

Heat Release Epoxy System for monocrystalline ingot fixturing.

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing...

Base MaterialBond Strength 24 hrs (psi)Bond Strength 4 hrs (psi)Bond Strength 8 hrs (psi)ColorCure Time (hrs)Density (g/cc)Gel Time (min)Hardness (Shore "D")Mixing Ratio (by volume)Viscosity (cps)
Epoxy2,100350380White/Yellow21.037742275000