Category - Wafering Adhesives

Valtron® AD1210-A / AD1769-B

Slow Curing Ingot Mounting Epoxy System

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing processes.…

Base MaterialHardness (Shore “D”)Density (g/cc)Bond Strength 8 hrs (psi)Cure Time (hrs)Mixing Ratio (by volume)Viscosity (cps)Color
Epoxy771.211,700610065000Gray/Red
Category - Wafering Adhesives

Valtron® AD1230-A / AD1210-B

Water Resistant Ingot Mounting Epoxy System

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing processes.…

Base MaterialHardness (Shore “D”)Density (g/cc)Bond Strength 4 hrs (psi)Bond Strength 8 hrs (psi)Moveable Time (min)Cure Time (hrs)Gel Time (min)Mixing Ratio (by volume)Viscosity (cps)ColorGlass Transition Temp (C)
Epoxy821.215001,7002405501035000Gray/Green40
Category - Wafering Adhesives

Valtron® AD1238-A / AD3848-BR

Fast Curing Ingot Mounting Epoxy System

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing processes.…

Base MaterialHardness (Shore “D”)Density (g/cc)Bond Strength 4 hrs (psi)Bond Strength 8 hrs (psi)Moveable Time (min)Cure Time (hrs)Gel Time (min)Mixing Ratio (by volume)Viscosity (cps)ColorGlass Transition Temp (C)
Epoxy841.212,2002,7003025170000Gray/Red35
Category - Wafering Adhesives

Valtron® AD1339-A / AD3905-B

Increased Hardness and Gel Time Ingot Mounting Epoxy System

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing processes.…

Base MaterialHardness (Shore “D”)Density (g/cc)Bond Strength 4 hrs (psi)Bond Strength 8 hrs (psi)Moveable Time (min)Cure Time (hrs)Gel Time (min)Mixing Ratio (by volume)Viscosity (cps)ColorGlass Transition Temp (C)
Epoxy851.471,8002,00060430143000White/Purple40
Category - Wafering Adhesives

Valtron® AD1339-A / AD3939-B

Increased Hardness Ingot Mounting Epoxy System

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing processes.…

Base MaterialHardness (Shore “D”)Density (g/cc)Bond Strength 4 hrs (psi)Bond Strength 8 hrs (psi)Moveable Time (min)Cure Time (hrs)Gel Time (min)Mixing Ratio (by volume)Viscosity (cps)ColorGlass Transition Temp (C)
Epoxy851.651,8001,800602151115000White/Blue40
Category - Wafering Adhesives

Valtron® AD4010-A / AD4015-B

Heat Release Epoxy System for monocrystalline ingot fixturing.

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing processes.…

Base MaterialHardness (Shore “D”)Density (g/cc)Bond Strength 4 hrs (psi)Bond Strength 8 hrs (psi)Bond Strength 24 hrs (psi)Cure Time (hrs)Gel Time (min)Mixing Ratio (by volume)Viscosity (cps)Color
Epoxy741.141,1001,6002,10024111500White/Yellow
Category - Wafering Adhesives

Valtron® AD4010-A / AD4017-B

Heat Release Epoxy System for monocrystalline ingot fixturing.

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing processes.…

Base MaterialHardness (Shore “D”)Density (g/cc)Bond Strength 4 hrs (psi)Bond Strength 8 hrs (psi)Bond Strength 24 hrs (psi)Cure Time (hrs)Gel Time (min)Mixing Ratio (by volume)Viscosity (cps)Color
Epoxy741.033503802,100272275000White/Yellow