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Conditioners (7)
Edge Grinding (2)
Grinding and Slicing (12)
ID Slicing Blades (2)
Lapping Additives (8)
Molded Products (7)
Polishing Fixtures (7)
Polishing Pads (35)
Polishing Slurries (132)
Rinsing and Cleaning (2)
Sonic Cleaning (13)
Wafering Adhesives (7)
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Eminess™
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Product Brands
Acuplane™
Celexis™
Challenge
IC1000™
Kinik®
Klebosol™
Nanopure™
Politex™
Suba™
Tensor
Ultra-Sol®
Valtron®
Vector
Conditioners
Products designed to improve the performance and lifetime of other consumables used in polishing, grinding, or cutting.
Edge Grinding
Stainless steel wheels manufactured with 100% natural diamonds electronically nickel-plated.
Grinding and Slicing
Synthetic formulations designed to optimize removal rate and surface finish in grinding, sawing, and dicing processes.
ID Slicing Blades
Inside diameter blades manufactured with 100% natural diamonds for precision wafering of materials such as quartz, samarium cobalt, ceramics, and sapphire.
Lapping Additives
Polymer based formulations designed to improve the performance of non-suspension treated abrasives.
Molded Products
Custom molded polymers include ingot slicing beams, dicing blocks, and ingot support beams. Frequently required for mounting materials prior to ID and wire saw wafering.
Polishing Fixtures
Disposable fiberglass templates which eliminate the need to wax mount wafers and manufactured with a wide variety of backing films to meet any customer requirement.
Polishing Pads
Dow® polishing pads distributed and/or customized by Eminess for unique markets including optics, semiconductor, storage media, and specialty materials.
Polishing Slurries
Unique blends of abrasive materials with advanced chemistries built on particles such as colloidal silica, aluminum oxide, diamond, and cerium oxide.
Rinsing and Cleaning
Economical formulations used to store, clean or rinse wafers either between or after lapping and polishing.
Wafering Adhesives
Two-component quick-curing epoxy products with industry leading cure times, commonly used in photovoltaic and semiconductor wafer processing.