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DF200

Standard CMP Backing Film

The original pad material created both for polishing and backing films, the DF200 continues to be an industry standard in many industries. As a finishing pad, it's quality construction yields excellent surface finish, lifetime, and...

Base Material	Compressibility	Thickness
Poromeric	10 %	25

DuPont® IC1000™ Polishing Pads

The Industry Standard for Chemical Mechanical Planarization

IC1000™ pad is the industry-standard polishing pad for chemical mechanical planarization (CMP). The IC1000 pad is made of a rigid, micro-porous polyurethane material. These properties enable the IC1000 pad to deliver localized planarization, excellent removal...

Applications: Berylium, Germanium, Indium Phosphide, Nickel, Polysilicon, Sapphire, Silicon Carbide, Tungsten, Zinc Selenide

Base Material	Compressibility	Hardness	Hardness Test	Thickness
Urethane	2.25 %	57	Shore D	50

DuPont® IC1010™ Chemical Mechanical Polishing Pads

The Industry Standard for Chemical Mechanical Planarization

The IC1010™ polishing pad is designed for optimal chemical mechanical planarization (CMP) performance on the Applied Materials Mirra and Reflexion polisher platforms. The IC1010 pad is a rigid microporous polyurethane pad with a proprietary radial...

Applications: Berylium, Germanium, Indium Phosphide, Nickel, Polysilicon, Sapphire, Silicon Carbide, Tungsten, Zinc Selenide

Base Material	Compressibility	Hardness	Hardness Test	Thickness
Urethane	2.25 %	57	Shore D	80

DuPont® IC1010™ Chemical Mechanical Polishing Pads with Window

The Industry Standard for Chemical Mechanical Planarization

The IC1010™ polishing pad is designed for optimal chemical mechanical planarization (CMP) performance on the Applied Materials Mirra and Reflexion polisher platforms. The IC1010 pad is a rigid microporous polyurethane pad with a proprietary radial...

Applications: Berylium, Germanium, Indium Phosphide, Nickel, Polysilicon, Sapphire, Silicon Carbide, Tungsten, Zinc Selenide

Base Material	Compressibility	Hardness	Hardness Test	Thickness
Urethane	2.25 %	57	Shore D	80

EXTERION(TM)

Exterion polishing pads

EXTERION pads are an advanced urethane with ceria filler, specifically formulated to meet the needs of different glass and optical polishing applications. The unique and controlled pore structure differenciate them from competitor pads in both performance...

Applications: Acryllic, Aluminosilicate, APEX, BK7, BK9, Borofloat, Borosilicate, Ceramic, Crystal Quartz, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Glass, Gorrilla, Leaded Crystal, Phosphate, Pyrex, SF6 Flint, Soda Lime - Float, Zinc Borosilicate

Base Material	Compressibility	Hardness	Hardness Test	Thickness
Urethane	3 %	86	JIS	50

FP5

Robust Poromeric Finishing Pad

Developed in-house by Eminess Technologies, the FP5 finishing pad offers a more robust alternative to Politex. In many applications it has demonstrated longer life to unique pore structure. It is a popular alternative for customers...

Applications: Cadmium Zinc Telluride, Gallium Arsenide

Base Material	Compressibility	Thickness
Poromeric	12 %	55.1

GS Polishing Pad 0.150"

Polyurethane Impregnated Non-Woven Felt Pad

GS is a non-woven material which combines a uniform, moderately permeable pore structure with a firm, dense base. GS is ideal for aggressive polishing processes. The GS material is particularly effective in replacing wool and...

Applications: Glass, Zerodur

Base Material	Compressibility	Hardness	Hardness Test	Thickness
Felt	5 %	45	Shore D	150

GS Polishing Pad 0.180"

Polyurethane Impregnated Non-Woven Felt Pad

GS is a non-woven material which combines a uniform, moderately permeable pore structure with a firm, dense base. GS is ideal for aggressive polishing processes. The GS material is particularly effective in replacing wool and...

Applications: Glass, Zerodur

Base Material	Compressibility	Hardness	Hardness Test	Thickness
Felt	5 %	45	Shore D	180

GS Polishing Pad 0.220"

Polyurethane Impregnated Non-Woven Felt Pad

GS is a non-woven material which combines a uniform, moderately permeable pore structure with a firm, dense base. GS is ideal for aggressive polishing processes. The GS material is particularly effective in replacing wool and...

Applications: Glass, Zerodur

Base Material	Compressibility	Hardness	Hardness Test	Thickness
Felt	5 %	45	Shore D	220

IC OPTIC

IC Optic

Next generation optical surfaces will be manufactured in rigorous, predictive, process-controlled environments. Recognizing that your polishing consumables require that same consistency, Eminess is pleased to offer IC OPTIC. Made from the same controlled variation-free material...

Applications: Aluminosilicate, APEX, Berylium, BK7, BK9, Borofloat, Borosilicate, Ceramic, Cleartran - Zn Su Multi-spectral, Crystal Quartz, Fused, Fused Silica, Germanium, Glass, Gorrilla, Leaded Crystal, Phosphate, Poly Carbonate lens, Pyrex, Quartz, SF6 Flint, Soda Lime - Float, Zerodur, Zinc, Zinc Borosilicate, Zinc Selenide, Zinc Sulfide

Base Material

Urethane

MHN15A020

Advanced Polyurethane Pads

MH polishing pads are uniquely designed for polishing and finishing a wide variety of surfaces where flatness and ultra-precision surface finish is critical. These materials include glass surfaces, ceramic components, precision lenses, semiconductor wafers and...

Applications: Berylium, Cadmium Zinc Telluride, Calcium Fluoride, Fused Silica, Lithium Niobate, Lithium Tantalate, Sapphire, Stainless Steel

Base Material	Compressibility	Hardness	Hardness Test	Thickness
Urethane	3.05 %	84	JIS	20

MHN15A039

Advanced Polyurethane Pads

MH polishing pads are uniquely designed for polishing and finishing a wide variety of surfaces where flatness and ultra-precision surface finish is critical. These materials include glass surfaces, ceramic components, precision lenses, semiconductor wafers and...

Applications: Berylium, Cadmium Zinc Telluride, Calcium Fluoride, Fused Silica, Lithium Niobate, Lithium Tantalate, Sapphire, Stainless Steel

Base Material	Compressibility	Hardness	Hardness Test	Thickness
Urethane	3.05 %	84	JIS	39

MHN15A050

Advanced Polyurethane Pads

MH polishing pads are uniquely designed for polishing and finishing a wide variety of surfaces where flatness and ultra-precision surface finish is critical. These materials include glass surfaces, ceramic components, precision lenses, semiconductor wafers and...

Applications: Berylium, Cadmium Zinc Telluride, Calcium Fluoride, Fused Silica, Lithium Niobate, Lithium Tantalate, Sapphire, Stainless Steel

Base Material	Compressibility	Hardness	Hardness Test	Thickness
Urethane	3.05 %	84	JIS	50

MHS15A050

Advanced Polyurethane Pads for the Silicon Market

MH polishing pads are uniquely designed for polishing and finishing a wide variety of surfaces where flatness and ultra-precision surface finish is critical. These materials include glass surfaces, ceramic components, precision lenses, semiconductor wafers and...

Applications: Berylium, Cadmium Zinc Telluride, Calcium Fluoride, Fused Silica, Lithium Niobate, Lithium Tantalate, Sapphire, Stainless Steel

Base Material	Compressibility	Hardness	Hardness Test	Thickness
Urethane	3.05 %	84	JIS	50

Optivision™

The Optivision™ pads is the newest generation of buffing pads used in final polishing step.

The Optivision 4540 has a dual pore structure; a combination of small pores dispersed amongst larger pores. This pore structure is advantageous over other finishing pads due to the increased number of contact points. The...

Applications: Copper CMP, Fused Silica, Germanium, TEOS

Base Material	Compressibility	Thickness
Poromeric	12 %	60

Politex™ Hi

Classic CMP Finishing Pad, Small Pore

Politex Hi was originally developed for final wafer polishing. It is manufactured from proprietary polyurethane and incorporates a unique, vertically oriented pore structure with a compressible substrate. The substrate is designed to instantaneously recover from...

Base Material	Compressibility	Thickness
Poromeric	13.75 %	60

Politex™ Reg

Classic CMP Finishing Pad

Politex Supreme (sometimes referred to as Politex Reg), was originally developed for final wafer polishing. It is manufactured from proprietary polyurethane and incorporates a unique, vertically oriented pore structure with a compressible substrate. The substrate...

Applications: Aluminum, Berylium, Cadmium Zinc Telluride, Calcium Fluoride, Ceramic, Fused Silica, Glass, Indium Phosphide, Lithium Niobate, Lithium Tantalate, Nickel, Polysilicon, Silicon, Tungsten, Zerodur

Base Material	Compressibility	Thickness
Poromeric	14.75 %	56

Politex™ Reg Embossed

Classic CMP Finishing Pad, Embossed

Embossed Politex was originally developed for final wafer polishing. It is manufactured from proprietary polyurethane and incorporates a unique, vertically oriented pore structure with a compressible substrate. The substrate is designed to instantaneously recover from...

Applications: Germanium, Glass, Silicon

Base Material	Compressibility	Thickness
Poromeric	14.75 %	56

SPM3100

CMP Finishing Pad

The SPM3100 poromeric technology was developed for silicon final polishing, and has also been used in a variety of other materials where surface finish is defined by haze, microscratches, and light point defects. The SPM3100...

Applications: Berylium, Fused Silica, Germanium, Lithium Niobate, Lithium Tantalate, Silicon, Silicon Carbide

Base Material	Compressibility	Thickness
Poromeric	5.75 %	28