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Valtron® AD1210-A / AD1769-B
Slow Curing Ingot Mounting Epoxy System
VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing...
| Base Material | Bond Strength 8 hrs (psi) | Color | Cure Time (hrs) | Density (g/cc) | Hardness (Shore "D") | Mixing Ratio (by volume) | Viscosity (cps) |
| Epoxy | 1,700 | Gray/Red | 6 | 1.21 | 77 | 100 | 65000 |
Valtron® AD1230-A / AD1210-B
Water Resistant Ingot Mounting Epoxy System
VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing...
| Base Material | Bond Strength 4 hrs (psi) | Bond Strength 8 hrs (psi) | Color | Cure Time (hrs) | Density (g/cc) | Gel Time (min) | Glass Transition Temp (.C) | Hardness (Shore "D") | Mixing Ratio (by volume) | Moveable Time (min) | Viscosity (cps) |
| Epoxy | 500 | 1,700 | Gray/Green | 5 | 1.21 | 50 | 40 | 82 | 10 | 240 | 35000 |
Valtron® AD1238-A / AD3848-BR
Fast Curing Ingot Mounting Epoxy System
VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing...
| Base Material | Bond Strength 4 hrs (psi) | Bond Strength 8 hrs (psi) | Color | Cure Time (hrs) | Density (g/cc) | Gel Time (min) | Glass Transition Temp (.C) | Hardness (Shore "D") | Mixing Ratio (by volume) | Moveable Time (min) | Viscosity (cps) |
| Epoxy | 2,200 | 2,700 | Gray/Red | 2 | 1.21 | 5 | 35 | 84 | 1 | 30 | 70000 |
Valtron® AD1339-A / AD3905-B
Increased Hardness and Gel Time Ingot Mounting Epoxy System
VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing...
| Base Material | Bond Strength 4 hrs (psi) | Bond Strength 8 hrs (psi) | Color | Cure Time (hrs) | Density (g/cc) | Gel Time (min) | Glass Transition Temp (.C) | Hardness (Shore "D") | Mixing Ratio (by volume) | Moveable Time (min) | Viscosity (cps) |
| Epoxy | 1,800 | 2,000 | White/Purple | 4 | 1.47 | 30 | 40 | 85 | 1 | 60 | 43000 |
Valtron® AD1339-A / AD3939-B
Increased Hardness Ingot Mounting Epoxy System
VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing...
| Base Material | Bond Strength 4 hrs (psi) | Bond Strength 8 hrs (psi) | Color | Cure Time (hrs) | Density (g/cc) | Gel Time (min) | Glass Transition Temp (.C) | Hardness (Shore "D") | Mixing Ratio (by volume) | Moveable Time (min) | Viscosity (cps) |
| Epoxy | 1,800 | 1,800 | White/Blue | 2 | 1.65 | 15 | 40 | 85 | 1 | 60 | 115000 |
Valtron® AD4010-A / AD4015-B
Heat Release Epoxy System for monocrystalline ingot fixturing.
VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing...
| Base Material | Bond Strength 24 hrs (psi) | Bond Strength 4 hrs (psi) | Bond Strength 8 hrs (psi) | Color | Cure Time (hrs) | Density (g/cc) | Gel Time (min) | Hardness (Shore "D") | Mixing Ratio (by volume) | Viscosity (cps) |
| Epoxy | 2,100 | 1,100 | 1,600 | White/Yellow | 2 | 1.14 | 4 | 74 | 1 | 11500 |
Valtron® AD4010-A / AD4017-B
Heat Release Epoxy System for monocrystalline ingot fixturing.
VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing...
| Base Material | Bond Strength 24 hrs (psi) | Bond Strength 4 hrs (psi) | Bond Strength 8 hrs (psi) | Color | Cure Time (hrs) | Density (g/cc) | Gel Time (min) | Hardness (Shore "D") | Mixing Ratio (by volume) | Viscosity (cps) |
| Epoxy | 2,100 | 350 | 380 | White/Yellow | 2 | 1.03 | 7 | 74 | 2 | 275000 |